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I-line photoresist evaluations for contact hole performance with attenuated phase-shift reticles

机译:I-line光刻胶评估相移掩模版的接触孔性能

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Abstract: Evaluation of contact holes ranging from 0.35 $mu@m to 0.7 $mu@m for a number of i-line photoresists and attenuated phase-shift reticles has been completed. The study compared the effects of different photoresists patterned with a binary reticle as well as attenuated phase-shift reticles having transmission levels of 6%, 8%, and 12%. The measures of contact performance used to compare resist/reticles are focus budget, exposure latitude, and resolution. From the data collected, a large process window for sub half-micron contacts is demonstrated by using an optimum resist/reticle combination. With phase-shift, an increase in focus budget is realized with the amount of improvement dependent on the resist and transmission of the reticle. The resolution capability of all of the resists is improved by using phase-shift, although, phase-shift did not affect the linearity of the resists. Data collected points to the importance of optimizing the resist process with transmission level and applying the proper bias to maximize the focus budget. !7
机译:摘要:已经完成了对许多i线光刻胶和衰减相移掩模版的接触孔的评估,其接触孔的范围从0.35μm至0.7μμm。这项研究比较了用二元掩模版以及透射率分别为6%,8%和12%的衰减相移掩模版构图的不同光刻胶的效果。用于比较抗蚀剂/掩模版的接触性能的度量是聚焦预算,曝光范围和分辨率。根据收集的数据,通过使用最佳的抗蚀剂/掩模版组合,可以显示出亚半微米触点的较大处理窗口。通过相移,实现了聚焦预算的增加,而改进的程度取决于光罩的抗蚀剂和透射率。通过使用相移可以提高所有抗蚀剂的分辨率,尽管相移不影响抗蚀剂的线性。收集的数据指出了在透射水平下优化抗蚀剂工艺并施加适当偏差以最大化聚焦预算的重要性。 !7

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