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Investigating deprotection-induced shrinkage and retro-grade sidewalls in NTD resists

机译:研究NTD抗蚀剂中脱保护引起的收缩和逆行侧壁

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摘要

Two aspects of NTD resists, deprotection-induced shrinkage, and retro-grade sidewalls, are investigated through experimentation and simulation. Simulation predicts that NTD resist profiles should often have retro-grade sidewall angles due to the attenuation of light as it propagates down through the resist. Resist shrinkage induced from both the deprotection during PEB and from exposure to electrons during SEM can cause CD and sidewall changes. The interplay between the shrinkage and the retro-grade sidewalls is discussed.
机译:通过实验和模拟研究了NTD抗蚀剂的两个方面,即脱保护引起的收缩和逆行侧壁。仿真预测,由于光向下传播穿过抗蚀剂时,光的衰减,NTD抗蚀剂轮廓通常应具有逆行的侧壁角度。 PEB期间的脱保护和SEM期间的电子暴露所引起的抵抗收缩可导致CD和侧壁发生变化。讨论了收缩和逆行侧壁之间的相互作用。

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