THERMAL CHARACTERIZATION OF HYSOL EPOXY PASTE ADHESIVE

摘要

Hysol EA 934NA adhesive is planned for use in India’s G-SAT6 communication satellite. The adhesive bonded systems are exposed to temperatures in the range of -125℃ to+150℃. Hence, a thorough thermal characterization of the cured adhesive was carried out by standard thermal techniques like, differential scanning calorimeter, thermo gravimetric analysis and thermo mechanical analysis. The thermal stability was evaluated in the proposed temperature range. The glass transition of the material was observed around 65℃. The properties of the adhesive were also measured in the selected temperature range. The specific heat varies from 0.65 to 1.65 J/g/℃ and the mean coefficient of thermal expansion by curve fit is found to be 72μm/m℃.