首页> 外文会议>Navigating the Global Landscape for the New Composites >DEVELOPMENT OF HIGHLY HEAT RESISTANT CFRPS PREPARED FROM HIGHLY SOLUBLE, ASYMMETRIC AND ADDITION-TYPE IMIDE RESINS
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DEVELOPMENT OF HIGHLY HEAT RESISTANT CFRPS PREPARED FROM HIGHLY SOLUBLE, ASYMMETRIC AND ADDITION-TYPE IMIDE RESINS

机译:由高溶解度,不对称和附加型酰亚胺树脂制备的高耐热性CFRPS的开发

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摘要

Novel addition-type phenylethynyl containing imide oligomers (degree of polymerization: n = 1–rn10) were derived from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), 2-phenyl-(4,4'-rndiaminodiphenyl ether) (p-ODA) for use as the matrix resin of highly heat-resistant carbon fiberreinforcedrncomposites. The uncured imide oligomers showed good solubility (more than 30 wtrn%) in N-methyl-2-pyrrolidone (NMP) and very low melt viscosities. These imide oligomers werernconverted to cross-linked structures after curing at 370 ℃. The glass transition temperature andrnelongation at break (ε_b) of the cured imide resin were found to be excellent (almost 340 ℃ andrn>15 %, respectively). Furthermore, imide solution prepregs were prepared from the imidernoligomer solution and carbon fibers. A void-less polyimide/carbon fiber composite with high Tgrnwas also achieved for fabrication via the imide solution prepregs.
机译:新型加成型含苯基乙炔基的酰亚胺低聚物(聚合度:n = 1-rn10)来自1,2,4,5-苯四甲酸二酐(PMDA),2-苯基-(4,4'-rndiaminodiphenyl ether)( p-ODA)用作高度耐热的碳纤维增强复合材料的基质树脂。所述未固化的酰亚胺低聚物在N-甲基-2-吡咯烷酮(NMP)中显示出良好的溶解度(大于30重量%),并且熔体粘度非常低。这些酰亚胺低聚物在370℃固化后被转化为交联结构。发现固化的酰亚胺树脂的玻璃化转变温度和断裂伸长率(ε_b)极好(分别接近340℃,rn> 15%)。此外,由亚氨基低聚物溶液和碳纤维制备酰亚胺溶液预浸料。通过酰亚胺溶液预浸料的制备,也获得了具有高Tgrn的无空隙的聚酰亚胺/碳纤维复合材料。

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  • 来源
  • 会议地点 North Charleston SC(US)
  • 作者单位

    Frontier Material Development Laboratories, Kaneka Corp.,rn5-1-1, Torikai-nishi, Settu, Osaka 566-0072 JAPAN;

    Aerospace Research of Directorate, JAXA,rn6-13-1 Ohsawa, Mitaka, Tokyo 181-0015 JAPAN;

    Aerospace Research of Directorate, JAXA,rn6-13-1 Ohsawa, Mitaka, Tokyo 181-0015 JAPAN;

    Institute of Space and Astronautical Science (ISAS), Japan Aerospace Exploration Agencyrn(JAXA), 3-1-1 Yoshinodai, Kanagawa 252-5210 JAPAN;

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