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Rapid Prototyped Nanocrystalline Copper Parts by Jet Electrodeposition

机译:喷射电沉积快速成型纳米晶铜零件

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The system components and the theory of jet electrodeposition orientated by rapid prototyping (RP) are introduced.The nanocrystalline copper parts with simple shape were fabricated by RP technology. The microstructure evolution of the nanocrystalline Copper layer was examined by means of the Scanning Electron Microscopy (SEM) and X-ray Diffraction (XRD). The results show that the jet electrodeposition can greatly enhance the limited current density, fine crystalline particles and improve deposition quality. The copper deposited layers have nanocrystalline microstructure with average size of 55.6nm. The grain size decreases to 41.4 nm in crystal plane (311).
机译:介绍了通过快速成型(RP)定向的系统组成和喷射电沉积的原理。采用RP技术制备了形状简单的纳米晶铜零件。通过扫描电子显微镜(SEM)和X射线衍射(XRD)检查了纳米晶体铜层的微观结构演变。结果表明,喷射电沉积可以大大提高有限的电流密度,细小的晶体颗粒并改善沉积质量。铜沉积层具有平均尺寸为55.6nm的纳米晶体微观结构。在晶面(311)中,晶粒尺寸减小到41.4nm。

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