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Structure and Properties of Epoxy Resin/Poly (aryl ether ketone) Blends Cured with 4,4'-Diaminodiphenylmethane

机译:4,4'-二氨基二苯甲烷固化的环氧树脂/聚(芳醚酮)共混物的结构与性能

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The study on bisphenol A epoxy resin (EP)/4,4'-Diaminodiphenylmethane (DDM) system modified with poly(aryl ether ketone) (PEK-C) by the method of melt blending process is reported. The microscopic phase structure and morphology of impact fractured surface were observed by SEM, the phenomenon of microscopic phase separation and heat resistance property were studied by DMA. The results showed that PEK-C can disperse in the blends in the form of nanometer size (<100nm) particles or in the form of molecular size when the content of PEK-C lower than 10%, and the nano-particles are uniformly dispersed in the blends. The rough region of impact fractured surface with PEK-C modified sample is larger and more obvious, which indicated that toughness of the blends has been improved. The modified system has microscopic phase separation characteristics with higher content of PEK-C, as the same observed result of SEM, the glass transition temperature (Tg) of the blends moves towards higher temperature with the increasing content of PEK-C and the property of heat resistance has been improved.
机译:报道了通过熔融共混法将聚芳醚酮(PEK-C)改性的双酚A环氧树脂(EP)/ 4,4'-二氨基二苯甲烷(DDM)体系的研究。用扫描电镜观察了冲击断裂表面的微观相结构和形貌,用DMA技术研究了微观相分离现象和耐热性能。结果表明,当PEK-C的含量低于10%时,PEK-C可以以纳米尺寸(<100nm)颗粒或分子尺寸的形式分散在共混物中,并且纳米颗粒均匀分散。在混合中。用PEK-C改性的试样冲击断裂表面的粗糙区域更大且更明显,这表明共混物的韧性得到了改善。改进的体系具有较高的PEK-C含量的微观相分离特性,与SEM观察到的结果相同,随着PEK-C含量的增加和共混物的性能,共混物的玻璃化转变温度(Tg)向较高的温度方向移动。耐热性得到改善。

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