Laminar jet impingement convective heat transfer in partially vented enclosures typical of portable computer applications

摘要

A numerical study of laminar air jet impingement cooling of electronic components within compact, partially vented enclosures is reported. The study was conducted on a simplified geometry representative of the CPU compartment of a typical laptop computer. Included in the geometry was a detailed model of an Intel~(~R) Mobile Pentium~(~R) III processor chip cooled by an impinging jet. A finite control volume technique was used to solve for the velocity and temperature fields within the fluid and solid domains of the compartment. Convection, conduction and radiation effects were included in the simulations. The range of jet Reynolds numbers considered was 63-1500; the applied compartment heat load ranged from 5 to 15 W. Radiation effects were significant over the range of Reynolds numbers and heat loads considered, while the effect of natural convection was only noticeable for configurations when the ratio Gr/Re~2 exceeded 5. Parametric studies were completed to determine if the compartment geometry could be modified to exploit the fluid flow and heat transfer regimes present, resulting in improved heat rejection to the ambient.