Influence of low-pressure plasma treatment on the adhesion strength vacuum-produced metal-plastic composites using the example of polyamide 46 and

摘要

The aim of the study is to observe the adhesion behaviour of copper applied by physical vapour deposition on different types of polyamide (PA 46, PA 6) and to correlate the topographical and chemical properties of the polymeric surface with the copper. Furthermore the effects of the low pressure plasma treatment on the following metallization process and the possibilities to adjust the adhesion behaviour are investigated. During the investigations of the adhesive strength, the metal copper, which is the most common material used for vacuum technology coatings of plastics, has been studied.