首页> 外文会议>International Manufacturing Science and Engineering Conference >MOLECULAR DYNAMICS SIMULATION OF NANOPARTICLE INFILTRATION DURING BINDER JET PRINTING ADDITIVE MANUFACTURING PROCESS: A PRELIMINARY STUDY
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MOLECULAR DYNAMICS SIMULATION OF NANOPARTICLE INFILTRATION DURING BINDER JET PRINTING ADDITIVE MANUFACTURING PROCESS: A PRELIMINARY STUDY

机译:粘合剂喷射添加剂制造过程中纳米粒子浸润的分子动力学模拟:初步研究

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Binder Jetting Process involves binding layers of powder material through selective deposition of a liquid binder. Binder jetting is a fast and relatively inexpensive process which does not require a high-powered energy source for printing purpose. Additionally, the binder jetting process is capable of producing parts with extreme complexities without using any support structures. These characteristics make binder jetting an ideal choice for several applications including aerospace, biomedical, energy, and several other industries. However, a significant limitation of binder jetting process is its inability to produce printed parts with full density thereby resulting in highly porous structures. A possible solution to overcome the porosity problems is to infiltrate the printed structures with low-melting nanoparticles. The infiltrating nanoparticles help fill up the voids to densify the printed parts and also aids in the sintering of the printed green parts. In addition to increasing the density, the nanoparticle infiltration also helps improve the mechanical, thermal and electrical properties of the printed part along with bringing multi-functionality aspect. Currently, there is a lack of clarity of the nanoparticle infiltration process performed to improve the quality of parts fabricated through binder jetting. This research employs Molecular Dynamics simulation techniques to investigate the nanoparticle infiltration during binder jetting additive manufacturing process. The simulation is performed at different operating temperatures of 1400 K, 1500 K, and 1600 K. The study found that the infiltration process is significantly affected by the operating temperature. The infiltration height is found to be highest at the operating temperature of 1600 K while the porosity reduction is found to be maximum at 1500 K. The infiltration kinetics is affected by the cohesion of the nanoparticles causing blockage of channels at higher operating temperatures. The simulation model is validated by comparing with the Lucas-Washburn infiltration model. It is seen that the simulation model deviates from the theoretical prediction suggesting that multiple mechanisms are driving the infiltration process at the nanoscale.
机译:粘合剂喷射过程通过选择性沉积液体粘合剂涉及粉末材料的结合层。粘合剂喷射是一种快速且相对便宜的过程,不需要用于印刷目的的高功率能源。另外,粘合剂喷射过程能够在不使用任何支撑结构的情况下生产具有极端复杂性的部件。这些特性使粘合剂喷射了几种应用的理想选择,包括航空航天,生物医学,能源和其他几个行业。然而,粘合剂喷射过程的显着限制是它无法产生全密度的印刷部件,从而导致高度多孔的结构。克服孔隙率问题的可能解决方案是用低熔点纳米颗粒渗透印刷结构。浸润的纳米颗粒有助于填充空隙以使印刷部件致密化,并有助于打印的绿色零件的烧结。除了增加密度外,纳米颗粒渗透还有助于改善印刷部分的机械,热和电性能以及带来多功能方面。目前,纳米颗粒渗透过程缺乏清晰度,以提高通过粘合剂喷射制造的零件质量。本研究采用分子动力学模拟技术来研究粘合剂喷射添加剂制造工艺中的纳米颗粒浸润。在1400k,1500k和1600k的不同工作温度下进行模拟。该研究发现渗透过程受工作温度的显着影响。发现渗透高度在1600 k的工作温度下最高,而孔隙率降低是最大的1500k。渗透动力学受到纳米颗粒的凝聚力的影响,导致在较高的工作温度下阻塞通道。通过与Lucas-Washburn Infiltration模型进行比较验证了仿真模型。可以看出,仿真模型偏离理论预测,表明多种机制在纳米级驱动渗透过程。

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