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SIMULATION OF COMPLEX PLASTIC FLOWS IN MACHINING OF METAL POLYCRYSTALS USING REMESHING

机译:用倒闭仿真金属多晶的复杂塑料流动

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The simulation of machining of soft metals at the 100 microns-few mm length-scale requires capturing complex flow physics induced by the high ductility and polycrystalline aggregate nature of these metals. This work presents a remeshing and mesh-to-mesh transfer approach that can successfully simulate complex flows including highly sinuous How with surface folding in polycrystalline aggregate cutting. The meshing scheme is both graded and adaptive, with the ability to automatically refine regions such as self-contacts. Notably, the presence of microstructure makes these simulations far more complex than their homogeneous counterparts, with several additional constraints on the remeshing algorithm. The approach is general, with no limitations on rake angle, grain-size, or friction coefficient, and does not use an artificial, predefined separation layer. The scheme accurately tracks individual grains and allows grain splitting in a manner consistent with imaging experiments. The plastic strain field, cutting-force evolution, and deformed grain shape from several annealed-copper cutting simulations are presented, representing a range of rake angles and friction coefficients as high as 0.5. The simulations accurately capture the thick chips, high cutting force, and highly undulating streaklines of flow that characterize sinuous flow, as well as the experimental observation that the sinuous flow is suppressed on using a high rake-angle for the cutting. Moreover, in grains that are split between the chip and residual surface, we can accurately capture the extreme grain stretching that is observed prior to splitting in imaging experiments. Remeshing also provides a way to accurately capture the residual surface plastic strains and strain gradients. The latter are particularly steep, with the strain falling from a value greater than 10 to 2 within a distance of 30 microns. The use of remeshing has numerous advantages over a predefined separation layer, including the fact that one can parametrically explore the effect of variables like the extent of yield stress inho-mogeneity on the flow pattern with no limitations. Interestingly, the technique allows us to find the actual line of material separation in such cutting processes: As opposed to a horizontal line, this is typically an undulating curve with a deviation of about 0.06 of the undeformed chip thickness on either side of the horizontal. This fraction increases with the extent of sinuous flow. A simple, pscudograin model with spatial inhomogeneity in flow stress is used to represent the microstructure in the present work, but the present scheme can easily be used with more complex microstructural models as well.
机译:在100微米毫米长度下的软金属加工模拟需要捕获由这些金属的高延展性和多晶聚集性诱导的复杂流物理。这项工作提出了一种倒闭和网格到网格传递方法,可以成功模拟复杂的流量,包括在多晶骨料切割中的表面折叠的高度换曲。啮合方案既是分级和自适应,能够自动改进诸如自接触的区域。值得注意的是,微观结构的存在使得这些模拟比其均匀对应物更复杂,在倒闭算法上具有几个附加限制。该方法是一般的,对耙角,粒径或摩擦系数没有限制,并且不使用人造预定分离层。该方案精确地跟踪各个晶粒并允许以与成像实验一致的方式分裂。提出了一种塑料应变场,切割力逸出和变形晶粒形状,其呈现出一系列高达0.5的耙角和摩擦系数。模拟精确地捕获厚的芯片,高切削力和高度起伏的流动流量,这些流动的流动流动,以及使用高耙角进行切割的抑制血流的实验观察。此外,在芯片和残余表面之间分离的晶粒中,我们可以精确地捕获在成像实验中分裂之前观察到的极端颗粒拉伸。回忆还提供了一种准确捕获残留表面塑料菌株和应变梯度的方法。后者特别陡峭,应变在30微米的距离内从大于10至2的值下降。倒闭的使用与预定的分离层具有许多优点,包括一种可以参数探索变量的效果,如流动模式上的屈服应力在没有限制的流动模式上的屈服应力造成的程度。有趣的是,该技术允许我们在这种切割过程中找到实际的材料分离线:与水平线相反,这通常是波状曲线,其在水平两侧上的未变形芯片厚度的偏差约0.06。这种分数随着蜿蜒的流量的程度而增加。流量应力中具有空间不均匀性的简单的PSCudograin模型用于表示本作工作中的微观结构,但是本发明方案也可以容易地与更复杂的微观结构模型一起使用。

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