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Sub-ns Polarization Switching in 25nm FE FinFET toward Post CPU and Spatial-Energetic Mapping of Traps for Enhanced Endurance

机译:25nm FIFFET的SUB-NS偏振切换到CPU后陷阱和陷阱的空间能量映射,提高耐久性

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In this work, we report sub-ns polarization switching in highly scaled 25 nm ferroelectric (FE) FinFET with Hf0.5Zr0.5O2 (HZO) ferroelectric (FE)/SiO2 dielectric (DE) gate stack for high performance CPU application for the first time. Observed limited endurance was attributed to the increase of trap density in the stack, which was quantitatively analyzed upon program/erase cycles by various methods including newly adopted low-frequency noise (LFN) characteristics for resolving spatial and energetic distribution of traps. In particular, we identified three different types of traps at FE/DE interface (Dit_2) and SiO2/Si channel interface (Dit_1) as well as in the bulk oxide (Not) of the HZO/SiO2 gate stack of FE FinFETs. In addition, with the developed trap analysis, we investigated radiation-induced degradation of HZO/SiO2 gate stack for application under harsh environments. Highly scaled and high performance FE FinFETs with enhanced endurance would provide a viable solution for future platform of low-power computing.
机译:在这项工作中,我们报告子纳秒偏振开关在高度缩放25nm的铁电(FE)的FinFET与HF 0.5 Zr. 0.5 O. 2 (HZO)铁电(FE)/二氧化硅 2 对于首次高性能CPU应用电介质(DE)栅极堆叠。观察到有限的耐力是由于陷阱密度的堆叠中的增加,其通过各种方法,包括新通过低频噪声(LFN)解决陷阱的空间和充满活力的分布特征在编程/擦除循环定量分析。特别是,我们确定了三种不同类型的在FE / DE界面陷阱(d it_2 )和SiO 2 / Si沟道界面(d it_1 ),以及在本体氧化物(N OT )所述HZO /二氧化硅的 2 FE FinFET的栅极堆叠。此外,与发达陷阱分析中,我们调查HZO /二氧化硅的辐射诱导的降解 2 栅堆叠下恶劣环境的应用程序。高扩展和高性能的FE的FinFET增强耐力将提供低功耗计算的未来平台的可行方案。

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