Effects of different vibration directions on the damage mechanism of BGA under vibration loading coupled with cyclic thermal

摘要

In this paper, the effects of different vibration directions on the damage mechanism of BGA are analyzed under vibration loading coupled with cyclic thermal. The PCB board is designed to install the BGA chip and the specific fixture is designed to fix the test piece of PCB board on the temperature-vibration test chamber. Thus the BGA joins can be tested under vibration of directions of 0 degrees, 30 degrees, 45 degrees, and 90 degrees, coupled with cyclic thermal. Results indicate that different vibration directions greatly affect the damage mechanism of BGA joint, rate of strain accumulation are about 0.1με/min in direction of 45°, 0.05με/min in direction of 90°,0.14με/min in direction of 30°, and 0.16με/min in direction of 0°, which show that the strain accumulation near solder joints under horizontal vibration rises fastest, and the strain accumulation near solder joints under vertical vibration rises slowest. Besides, fluctuation amplitudes of strains near solder joints are different, fluctuation amplitudes of strains under horizontal vibration is largest, and fluctuation amplitudes of strains under vibration of 30° is smallest.