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Evaluation of Intel Xeon E5-2600v2 based cluster for technical computing workloads

机译:基于英特尔Xeon E5-2600V2的技术计算工作负载评估

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In Intel's CPU releasing model, the new Ivy Bridge is a “TICK” that follows Sandy Bridge's (“TOCK”) microarchitecture principles, however, after undergoing a die shrink it is manufactured at 22nm. It also incorporates new micro-architectural upgrades. In this paper we shall evaluate the performance of a 16 bi-socket node cluster based on this 3rd generation Intel Xeon Processor E5-2697v2 meant for server and workstation market. The new architectural improvements are assessed via High Performance Computing Challenge (HPCC) benchmarks and NAS Parallel Benchmarks (NPB) where the interconnect technology is challenged by the standard Intel® MPI Benchmark suite performance evaluator. Finally we tested performance of the new system using the subset of the benchmark from PRACE consortium. We compare achieved results against the outcomes of the tests performed on clusters based on previous generations of Intel Xeon processors: Intel Xeon E5-2680 (“Sandy Bridge-EP”), Intel Xeon 5680 (“Westmere-EP”) and Intel Xeon 5570 (“Nehalem-EP”) respectively.
机译:在英特尔的CPU释放模型中,新的常春藤桥是一个“蜱圈”,伴随着桑迪桥(“Tock”)微体系结构原理,然而,在经历芯片缩小后,它在22nm处制造。它还采用了新的微型建筑升级。在本文中,我们将根据第三代英特尔Xeon处理器E5-2697V2评估16个双套接字节点集群的性能,适用于服务器和工作站市场。通过高性能计算挑战(HPCC)基准和NAS并联基准(NPB)进行评估新的架构改进,其中互连技术受标准英特尔®MPI基准套件性能评估仪挑战。最后,我们使用Prace Consortium的基准子集进行了新系统的性能。我们比较符合基于上一代英特尔Xeon处理器的集群执行的测试结果的结果:英特尔Xeon 5680(“Westmere-EP”)和英特尔Xeon 5570(“Sandy Bridge-Ep”)(“Sandy Bridge-Ep”) (“Nehalem-EP”)分别。

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