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Performance evaluation of nano-On-Chip Interconnect for SoCs

机译:SOCS纳米片互连的性能评估

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The On-Chip Interconnects (OCI) infrastructure represents one of most important components in determining the overall performance of future System-on-Chip (SoC). Recently, nano-communication has emerged as a new paradigm that allows nanomachines to communicate using mechanisms, such as molecular-based, electromagnetic-based, acoustic-based, and mechanical-based techniques. In this paper, we study and evaluate the performance of the electromagnetic-based communication technique as an on-chip communication fabric for SoCs. Simulations have been conducted and preliminary results are reported to shed more light on the performance of this technique for large SoCs.
机译:片上互连(OCI)基础设施代表确定未来系统整体性能(SOC)的最重要组件之一。最近,纳米通信已成为一种新的范例,允许纳米载体使用机制进行通信,例如基于分子,基于电磁的,基于声学的和基于机械的技术。在本文中,我们研究和评估了基于电磁的通信技术的性能作为SOC的片上通信结构。已经进行了仿真,据报道初步结果揭示了这种技术对大型SOC的性能。

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