The Effects of Minor Element on Performance of Ag Alloy Wires on Al Pad in the Package

摘要

In recent years, gold prices continued to remain high. In order to lower cost, the gold wire packages substantial reduction and mostly converted to silver-palladium gold or copper palladium wire manufacturing process. The silver wire has high conductivity, high reliability and wide applied to the memory, the light-emitting diodes, and other products, but the price is still a little higher than copper material. To reduce costs and improve the reliability of expectations, this study by adding different trace elements copper (Cu), Nickel (Ni), indium (In), germanium (Ge), platinum (Pt) in the Ag alloy wire to reduce the precious silver metallic palladium, gold element content. This work investigates the hardness and interfacial IMC of seven Ag alloy wires with seven elements.