Detecting Kissing Disbond Defect in Adhesively Bonded Structures: A Review

摘要

Presently, the industry is increasing the use of adhesive bonding of modern complex materials to build durable enhanced engineering structures. Materials such as GLARE, CFRP and GRP, which are complex multilayer materials used to lower the weight to size ratio, increase damage tolerance and improve fire and corrosion resistance. One of the defects that can be found in such structures is Kissing Disbond. This imperfection is explained as undeveloped disbond that has intimate contact with zero or near zero bond strength, which is relatively challenging to detect by conventional non-destructive testing methods. Due to the geometry and elusive nature of this defect, many researchers worked on detecting this defect using different techniques. This paper will review and discuss the most recent work that focused on detecting and fabricating test samples with this defect. It will emphasis on the work done on adhesively bonded structures. Significant attributes of these studies will be compared at the end of this work, while a background about the defect will be mentioned in the next section.