Synchronized real-space and frequency-domain low-coherence interferometry for wafer thickness and metrology applications

摘要

We discuss the application of new synchronized, and virtually synchronized multiprobe real space and frequency domain low coherence interferometers for measurement of wafer thickness and topography. The recently developed low coherence frequency domain interferometers have been proved to be fast and effective tool for measurement of wafer topography, thickness and individual layers within multilayer structures. In our paper we present simple models describing performance of multiprobe metrology and compare it with other solutions.