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Loop Heat Pipes and mini-Vapour Cycle System for Helicopter Avionics Electronic Thermal Management

机译:用于直升机航空电子热管理的环热管和迷你蒸汽循环系统

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With the increase of heat flux densities generated by electronics, manufacturers are facing tremendous new challenges in which component heat flux might reach 100 W/cm~2. This scenario is pushing the research efforts towards the development of alternative solutions, which will be able to ensure the needed cooling demands of high-integrated electronics. Furthermore, when considering the aeronautical applications, the reliability, compactness, and lightness of the cooling systems represent essential and mandatory characteristics. With the continuous miniaturization of the components, passive and active two-phase cooling devices can now be applied to electronics systems while maintaining the fundamental compactness and lightness of the whole system. This paper presents the experimental assessment of an electronic cooling prototype especially designed for helicopter avionics thermal management in the framework of 7th FP EU project TOICA (Thermal Overall Integrated Conception of Aircraft, www.toica-fp7.eu). The prototype consists of a set of compact Loop Heat Pipes (LHPs) especially designed for the hot spot treatment at blade level and an air cooled mini-Vapor Cycle System (mini-VCS), which is devoted to the overall heat rejection. One innovative concept of this system design lies in the presence of a thermal connector, named thermal plug, which acts as the evaporator of the mini-VCS, that cools down the LHP condenser. The experimental results are carried out at different hot spot heat loads, from 10 W to 50 W. The effect of different heat sink temperatures on the LHP thermal resistance is investigated. Furthermore, for a fixed evaporating temperature of the mini-VCS, the effects of vapor superheating at the outlet of the plug evaporator on the LHP thermal resistance is investigated. The proposed preliminary results allow to exploit the potentiality to use the proposed cooling technology in a typical airborne scenario.
机译:随着电子产品产生的热通量密度的增加,制造商面临着巨大的新挑战,其中元件热通量可能达到100W / cm〜2。这种情况正在推动替代解决方案的研究努力,这将能够确保高集成电子设备的所需冷却需求。此外,在考虑航空应用,冷却系统的可靠性,紧凑性和亮度代表必要和强制性的特征。随着组件的连续小型化,现在可以应用于电子系统的无源和有源两相冷却装置,同时保持整个系统的基本紧凑性和光照。本文介绍了在第7届FP欧盟项目Toica框架内专为直升机航空电子热管理设计的电子冷却原型的实验评估(航空器的热整体整合概念,www.toica-fp7.eu)。原型由一组紧凑的环路热管(LHPS)组成,特别是为叶片水平的热点处理设计,以及空气冷却的迷你蒸汽循环系统(MINI-VCS),该系统致力于整体散热。该系统设计的一个创新概念在于存在热连接器的存在,该热插拔是热插拔的,其用作迷你VCS的蒸发器,使LHP冷凝器冷却。实验结果是在不同的热点的热负荷下进行,从10瓦至50瓦不同散热器温度对LHP热阻进行了研究的影响。此外,对于Mini-Vcs的固定蒸发温度,研究了研究了在塞子蒸发器的出口处对LHP热阻的蒸气过热的影响。拟议的初步结果允许利用潜在的潜在能力在典型的空中场景中使用所提出的冷却技术。

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