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Mold growth on nonceramic insulators and its impact on electrical performance

机译:造型造型造型造型造型恒星绝缘子及其对电气性能的影响

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This paper describes the identification of a common mold (i.e., fungus) growing on nonceramic insulators (NCI) in service, and analyzes its impact on the electrical performance. The insulators evaluated were line posts removed from a 138 kV transmission line serving the interior (away from the coast) regions in Florida. The insulators had housings made from different types of silicone rubber (SR) and ethylene propylene rubber (EPR) polymer families. Electrical tests performed include surface resistance measurements and determination of contamination withstand capability (CWC) using the clean-fog procedure. Changes in the CWC were correlated to material changes by using micro-Fourier transform infra-red (FTIR) analysis and surface resistance measurements. It was concluded that the mold growth is dependent on material formulation and outdoor environment. On SR insulators that exhibited mold growth, there was a reduction in the CWC when compared to the same insulator without the mold; however, even the reduced level of CWC was superior to that obtained on similarly rated EPR and porcelain insulators without any visible mold growth. Lastly, simple methods to remove the mold from the insulators are listed.
机译:本文介绍了在营业中的常见模具(即真菌)的鉴定,并分析了对电气性能的影响。评估的绝缘体是从佛罗里达州内部(远离海岸)地区的138 ​​kV输电线路中取出的线柱。绝缘体具有由不同类型的硅橡胶(SR)和乙烯丙烯橡胶(EPR)聚合物家族制成的壳体。使用清洁雾程序包括所执行的电气测试包括表面电阻测量和污染耐受能力(CWC)的测定。通过使用微傅里叶变换红外线(FTIR)分析和表面电阻测量,CWC的变化与材料变化相关。结论是模具生长取决于材料配方和室外环境。在表现出模具生长的SR绝缘子上,与没有模具的相同绝缘体相比,CWC的减少;然而,即使CWC的降低水平也优于同样额定EPR和瓷绝缘体,而没有任何可见的模具生长。最后,列出了从绝缘体中取出模具的简单方法。

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