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Improve the laser damage resistance of fused silica by wet surface cleaning and optimized HF etch process

机译:通过湿表面清洁和优化的HF蚀刻工艺提高熔融二氧化硅的激光损伤阻力

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Fabrication-induced metal contaminations and subsurface damage are generally identified as the laser damage initiators that are responsible for the laser induced damage in fused silica. In this paper, the removal of those two initiators are realized by two methods: wet chemical surface cleaning and optimized HF-based etch process. Two kinds of chemical leaching are used to removing the Ce and other metal impurities respectively. In order prevent the redeposition of the reactive byproducts during HF etch process, we optimized the traditional HF etch process in two ways: absence of NH_4F in etch solution and presence of megasonic & ultrasonic agitation during & after etch respectively. And laser damage tests show that these two treatments greatly improve the laser damage resistance of fused silica.
机译:制造诱导的金属污染物和地下损伤通常被鉴定为负责激光诱导熔融二氧化硅损伤的激光损伤引发剂。 在本文中,通过两种方法来实现这两种引发剂:湿化学表面清洁和优化的基于HF的蚀刻工艺。 两种化学浸出用于分别除去Ce和其他金属杂质。 为了防止在HF蚀刻工艺期间重新沉积反应性副产物,我们以两种方式优化了传统的HF蚀刻工艺:分别在蚀刻溶液中不存在NH_4F和难蚀于蚀刻后的兆克和超声搅拌的存在。 激光损伤试验表明,这两种治疗大大提高了熔融二氧化硅的激光损伤阻力。

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