Quantifying TEM Cell Electric and Magnetic Field Coupling to Arbitrary Orientation of Microstrip Lines

摘要

Electromagnetic compatibility (EMC) analysis of highspeed circuits is becoming mandatory due to the rapid increase in operating frequencies, RF interference and layout densities. Radiated susceptibility tests are important part of overall EMC analysis. In this paper the focus of investigation, is on models of the coupling between a transverse electromagnetic (TEM) field generated by the TEM cell and the arbitrarily oriented microstrip lines. The Method of Lines (MoL) is used to calculate the capacitance matrix for microstrip lines having different widths. This capacitance matrix is used for calculation of inductance matrix, i.e. self and mutual inductances. The calculated values of mutual capacitances and mutual inductances are introduced in coupling models for arbitrarily oriented lines, and simulation results are compared against measurement results. The presented models are very accurate and include only passive elements, and therefore can be used for efficient coupling modelling between microstrip lines and the TEM cell septum.