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Reactive Force-Field Molecular Dynamics Study of SiGe Thin Film Growth in Plasma Enhanced Chemical Vapor Deposition Processes

机译:血浆增强化学气相沉积过程中SiGe薄膜生长的反应力场分子动力学研究

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SiGe thin films, such as hydrogenated amorphous silicon germanium (α-SiGe:H) and hydrogenated microcrystalline silicon germanium (μc-SiGe:H), are formed by plasma enhanced chemical vapor deposition (PECVD) methods from SiH_4, GeH_4, and H_2. Thin film properties such as surface morphology, hydrogen content, and crystal structure are greatly affected by process parameters such as a substrate temperature, gas pressure, and gas composition. For example, SiH_3 and GeH_3 are dominant species when the SiGe thin film with low defect is deposited under low power density conditions. However, the structural defects are formed by SiH and SiH_2 that are highly reactive species under high power density conditions. Although the density and flux of these highly reactive species are much lower than those of the dominant species, the electrical properties of the device are greatly affected by a few structural defects. Therefore, to understand the influence of the composition of each precursor on the thin film properties is important. The purpose of the present study is to clarify the influence of the composition of multiple precursors such as SiH_3, GeH_3, and H under different substrate temperatures on the surface morphology, hydrogen content, and crystal structure.
机译:SiGe薄膜,例如氢化非晶硅锗(α-SiGe:H)和氢化微晶硅锗(μC-SiGe:H),通过等离子体增强的化学气相沉积(PECVD)方法来自SIH_4,GEH_4和H_2。诸如表面形态,氢含量和晶体结构的薄膜性能受工艺参数的大大影响,例如衬底温度,气体压力和气体组合物。例如,当在低功率密度条件下沉积具有低缺陷的SiGe薄膜时,SIH_3和GEH_3是主导物种。然而,结构缺陷由SiH和SiH_2形成,其在高功率密度条件下是高反应性物质。虽然这些高反应性物种的密度和通量远低于显性种类的密度和通量,但是该装置的电性能受到少数结构缺陷的大大影响。因此,要了解每种前体的组合物对薄膜特性的影响是重要的。本研究的目的是阐明在表面形态,氢含量和晶体结构上的不同基板温度下阐明多种前体的组合物如SiH_3,GEH_3和H的影响。

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