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Electropolishing of Type 304 Stainless Steel in an Amide Type Ionic Liquid Containing Chloride Ion

机译:含有氯离子酰胺型离子液体中的304型不锈钢的电极抛光

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Electropolishing of stainless steel (SUS) has been commercially performed in such aqueous acid solutions as phosphoric and sulfuric acid. The current process shows low current efficiency due to the oxygen evolution reaction. Amide type ionic liquids with wide electrochemical windows are expected as an alternative electrolyte for electropolishing of metals with high current efficiency. Although electropolishing of Ti, Cu, Pt, and Sn has been reported in amide type ionic liquids, there is no report for SUS. In addition, previous studies on electropolishing of SUS in nonaqueous electrolytes have suggested that chloride ions are necessary to promote the breakdown of the oxide film on SUS. In the present study, the anodic dissolution mechanism of type 304 SUS was investigated in an amide type ionic liquid, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) amide (BMPTFSA), containing chloride ions.
机译:不锈钢(SUS)的电抛光已经在这种含水溶液中商购进行,作为磷酸溶液和硫酸。 由于氧气进化反应,目前的方法显示出低电流效率。 具有宽电化学窗口的酰胺型离子液体是具有高电流效率的替代电解质的替代电解质。 虽然在酰胺型离子液体中据报道Ti,Cu,Pt和Sn的电抛光,但没有报告SUS。 此外,对非水电解质电解槽的前一种研究表明,氯离子是促进SUS上氧化膜的击穿所必需的。 在本研究中,在酰胺型离子液体,1-丁基-1-甲基吡咯烷鎓双(三氟甲基磺酰基)酰胺(BMPTFSA)中,研究了304型SUS的阳极溶解机制,含有氯离子。

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