carbon; chemical vapour deposition; electrostatic actuators; focused ion beam technology; microelectrodes; micromanipulators; nanostructured materials; silicon-on-insulator; sputter etching; 102 V; 17 micron; 19.6 micron; 2.21 micron; 3.4 micron; 3.5 micron; 30 V; 300 nm; 6.9 micron; 93 V; C; FIB-CVD; MEMS electrodes; SOI wafer; Young modulus; bent type tweezers; carbon tweezers; deep reactive ion etching; electrostatic actuation; electrostatic tweezing action; electrostatically actuated nanotweezers; focused ion beam; interconnecting platform; localized chemical vapor deposition; microelectromechanical system; microprocessed electrodes; nanoscale device; nanoscale tweezers; snap-down threshold voltages; straight type tweezers; Electrostatic force; Nano manipulation; Nanotweezer; Young's modulus; component;
机译:静电制备的单壁碳纳米管修饰电极的原子力显微镜和电化学研究
机译:基于微机电的驱动镊子测量单个碳粉颗粒上的静电荷的技术
机译:热力矩下的静电驱动FGM微镊子
机译:在微处理电极上制造的耐静电纳米镊子
机译:空间电荷对微米至纳米级静电驱动的影响。
机译:基于氧化石墨烯/银纳米线纳米复合材料的柔性透明图案化电极采用加速的紫外线/臭氧工艺控制银纳米线的降解
机译:采用软光刻技术制作的静电驱动微阀,用于集成微流体