Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator

摘要

The design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator is presented. The Multichip Module (MCM) on glass is build using copper metalisations and an inorganic Plasma Enhanced Chemical Vapour deposited (PECVD) silicon oxynitride (SiON) dielectric. Chip attachment is done by Flip Chip (gold on gold using Non Conductive Adhesives - NCA) and Chip&Wire (gold wedge - wedge). A gold finish on the module ensures an excellent Flip Chip attachment compatible with the other assembly techniques used (gold bonding and soldering).