首页> 外文会议>International symposium on trends and new applications of thin films;TATF '98 >Ion Sputtering of Metals in a System with a Thermionic Inert Gas Plasma Source
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Ion Sputtering of Metals in a System with a Thermionic Inert Gas Plasma Source

机译:具有热离子惰性气体等离子体源的系统中金属离子溅射

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A high-efficiency sputtering system with a thermionic source of inert gas plasma is described. Characteristics of the sputtering system were studied. Sputtering coefficients, etching rates and energy expenditure coefficients were investigated as functions of argon ion energy for Cr, Al, Mo, Ti and steel 3. It is shown that the sputtering system under study has a high productive capacity; the etching rate of the steel substrate reaches 30μm/h. The sputtering system provides for an easy control over the process of ion etching with an aid of several easily measurable and controllable parameters (negative potential of the substrate, magnetic intensity, cathode filament current and pressure), which are practically independent of each other in the operating pressure range employed. The sputtering system offers the advantage of using various operating gases such as Ar, Xe, He, N_2, H_2.
机译:描述了具有热离子源惰性气体等离子体源的高效溅射系统。 研究了溅射系统的特征。 研究了溅射系数,蚀刻速率和能量支出系数作为Cr,Al,Mo,Ti和钢的氩离子能量的功能。结果表明,正在研究的溅射系统具有高生产能力; 钢基板的蚀刻速率达到30μm/ h。 溅射系统通过辅助几种易于测量和可控的参数(基板的负电位,磁强,阴极丝电流和压力的负电位,易于控制离子蚀刻的过程,其实际上彼此独立 工作压力范围。 溅射系统提供了使用诸如AR,XE,HE,N_2,H_2的各种操作气体的优点。

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