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Investigation of sensitive depth on a 32-bit microprocessor by laser test

机译:激光试验对32位微处理器敏感深度的研究

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In this paper, the sensitive characteristics of the microprocessor based on Scalable Processor ARChitecture Version 8 (SPARC V8) architecture are studied by laser equipment which can simulate the single event effect (SEE) of device. Utilizing the adjustability of laser focal panel, we obtain the sensitive depth of devices which are fabricated in 180nm technology. Results show that the sensitive depth of the different sensitive areas is almost the same whose value is about 1μm. Therefore, we can draw a conclusion that the devices of the same technology have a certain sensitive depth. It offers essential information to the radiation hardened work in the future.
机译:在本文中,通过激光设备研究了基于可伸缩处理器架构8(SPARC V8)架构的微处理器的敏感特性,该激光设备可以模拟设备的单个事件效果(请参阅)。 利用激光焦面板的可调节性,我们获得了180nm技术制造的敏感深度。 结果表明,不同敏感区域的敏感深度几乎相同,其值约为1μm。 因此,我们可以得出结论,即相同技术的器件具有一定的敏感深度。 它提供了未来辐射硬化工作的基本信息。

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