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Effects of bias on the bonding structure and mechanical property of a-C:H films deposited by MFPUMST

机译:MFPumst沉积的A-C:H薄膜粘接结构与力学性能的影响

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Hydrogenated amorphous carbon (a-C:H) films on silicon wafers were prepared by middle frequency pulsed unbalanced magnetron sputtering technique (MFPUMST) at different substrate bias under the methane-argon mixed gases. Raman spectra show that the sp3 fraction in a-C:H films increases with increasing substrate bias voltage from 0 to 100 V, and then decreases when the substrate bias above 100 V. Nano-hardness for these films prepared under different substrate bias voltage show that nano-hardness increase with increasing substrate bias voltage from 0 to 100 V, and then decrease from 100 up to 200 V. The results above indicate that the sp3 fraction in the prepared a-C:H films is directly related to nano-hardness, therefore, substrate bias voltage is an important factor for influence on the bonding configuration of the deposited a-C:H films. The related mechanism is discussed by sub-plantation model in this paper.
机译:通过在甲烷 - 氩气混合气体下的不同底物偏压下中频脉冲不平衡磁控溅射技术(MFPumst)制备硅晶片上的氢化非晶碳(A-C:H)膜。拉曼光谱表明,AC:H膜中的SP3分数随着0至100V的增加而增加,然后当在不同衬底偏置电压下制备的这些薄膜的基板偏压时,纳米硬度达到纳米硬度表示纳米 - 硬度随着0至100V的增加而增加,然后从100升降低到200V。上述结果表明制备的AC:H膜中的SP3馏分与纳米硬度直接相关,因此,基板直接相关偏置电压是对沉积AC:H薄膜的粘接构型影响的重要因素。本文中的亚种植园模型讨论了相关机制。

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