OPTIMIZING THE PLASMA TREATMENT PROCESS PRIOR TO CONFORMAL COATING TO ELIMINATE ESD-INDUCED FAILURES WITHOUT IMPACT ON COATING PERFORMANCE

摘要

As market forces demand ever increasing complexity of integrated electronics their sensitivities to harsh environmental conditions become even more apparent. Electronics used in demanding applications such as marine avionics, aerospace, automotive or simply outdoors require enhanced protection to prevent damage to the components from the elements. Hermetic containers can be a solution or encapsulation with potting compounds. Parylene and super hydrophobic films are also possible solutions to encapsulate such electronics. Most typically though conformal coatings are applied to the electronics due to the ease of application and cost effectiveness of the material. Surface treatment of the electronic assemblies using plasma has been shown to be very effective improving the adhesion of conformal coating materials to the PCA's. Plasma surface treatment has also been shown to be effective for removal of residues such as mold release compounds and some flux materials. Plasma treatment has also been shown to effectively treat the high Tg materials now required for RoHS compliance. Plasma treatment is also beneficial for conformal coating flow and coverage. With all these benefits for conformal coating what could possibly go wrong with plasma?