ELECTRONIC ASSEMBLY-WHERE DO CONTAMINANTS COME FROM?

摘要

This presentation will discuss various sources of contamination that come from the fabrication and assembly steps, and their effect on electrical performance and mechanical adhesion. We will also discuss analytical methods to assess these residues including FTIR, SEM/EDX, Localized Extraction and Ion Chromatography. This presentation is a general primer on fabrication and assembly processes and case studies that discuss the effect of residues with both cleaning and no clean processes.