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Thermoelectric Study of Ag Doped SnSe-Sb2Se3 Based Alloy

机译:Ag掺杂SnSe-Sb2se3合金的热电学研究

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In this article we have synthesized p-type alloy of SnSe and Sb_2Se_3 (10 atomic %) to study the thermoelectric transport properties. The alloy was prepared by melt grown technique followed by spark plasma sintering and latter doped with 2 atomic % Ag to compensate the carrier density in order to achieve higher electrical conductivity (σ). Out of these, the doped sample resulted in the maximum figure of merit, ZT~ 0.7 at 773 K due to the existence of the secondary phase AgSbSe2 and reduced lattice thermal conductivity (0.61 W m~(-1) K~(-1) at 300 K). The fitted lattice thermal conductivity shows that point defect and Umklapp scattering are the primary process of phonon scattering for all the samples whereas the fitted mobility data confirms acoustic phonon scattering along with point defect and grain boundary scattering to be the main carrier scattering mechanism. More over room temperature carrier density and electrical conductivity are found to increase for the doped sample which further corroborate (90%)SnSe-(10%)Sb2Se3:2%Ag to be a potential candidate for highly efficient thermoelectric materials.
机译:在本文中,我们已经合成了SNSE和SB_2SE_3(10个原子%)的P型合金,以研究热电传输性能。通过熔融生长技术制备合金,然后通过火花等离子体烧结和后者掺杂有2原子%Ag以补偿载体密度以实现更高的电导率(σ)。出于这些中,由于二次相变22的存在,掺杂样品在773k下,Zt〜0.7处为773k,并降低晶格导热率(0.61Wm〜(-1)k〜(-1)在300 k)。拟合的晶格导热率表明,点缺陷和UMKLAPP散射是所有样品的声子散射的主要过程,而拟合的迁移率数据确认了声子散射以及点缺陷和晶界散射,以成为主要的载体散射机构。发现更多的过度室温载体密度和电导率对于掺杂的样品(90%)SnSe-(10%)Sb2Se3:2%Ag为高效热电材料的潜在候选者,掺杂的样品增加和电导率。

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