Nondestructive in chip multi-layer weak pattern real time detection — Hsin-Ming Hou

摘要

The quality of patterns printed on wafer may be attributed to factors such as process window control, pattern fidelity, overlay performance, and metrology. Each of these factors play an important role in making the process more effective by ensuring that certain design- and process-specific parameters are kept within acceptable variation. Since chip size and pattern density are increasing accordingly, in-line real time catching the in-chip weak patterns/defects per million opportunities (WP-DPMO) plays more and more significant role for product yield with high density memory.