Characterization of Ultrafine Structured Cu-TiC Compositeswith High Strength and High Conductivity by Mechanical Milling

摘要

Nowadays, there is a rising need for advanced materials which exhibit excellent strength,electrical and thermal conductivity. Copper, due to the good electrical and thermal conductivity, is the bestcandidate for those applications. A potential case is that the nanostructured copper matrix withhomogeneously dispersed nanoscale dispersoids. Mechanical milling was proved to be a promising methodto manufacturing such kind of materials. However, for the practical applications considering the electricalconductivity, long milling times are unacceptable because of the increased impurities and cost. In order todevelop a process that allow obtaining nanoscale dispersoids with the smallest size possible and a betteruniform distribution efficiently, a novel ball-milling method was proposed in this study.