The Characteristics of Fluid Flow and Heat Transfer in Wavy, Dimple and Wavy-Dimple Microchannels

摘要

The flow and heat transfer characteristics were numerically studied in wave, dimple and wave-dimple microchannels for thermal managements on the chip of Intel i7-996X with heat flux of 0.56 W/mm~2.The results show that, in microchannles heat sink, the dimple structure could reduce the flow resistances and the wavy wall could enhance heat transfer. According to the both advantages, two types of microchannel heat sink both with dimples and wavy walls were designed, and the flow and heat transfer characteristics were numerically studied. It is proved that the wave-dimple microchannels heat sink holds the characteristics of enhancing heat transfer with low pressure drop, which implies it has great potential of development and application prospect.