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Cryogenic Fracture of Cracked Piezoelectric Ceramics in Three-Point Bending under Electric Fields

机译:电场三点弯曲裂纹压电陶瓷的低温骨折

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This paper investigates theoretically and experimentally the cryogenic fracture behavior of cracked piezoelectric ceramics under electric fields. Fracture tests were performed in three-point bending with the single-edge precracked-beam (SEPB) specimens at room temperature (RT) and liquid nitrogen temperature (77 K), and the fracture loads under electric fields were obtained. Plane strain finite element analysis was also carried out using temperature-dependent material properties of the piezoelectric ceramics, and the dependence of the energy release rate on the electric field and temperature was discussed. In addition, possible mechanisms for cryogenic fracture were examined by scanning electron microscopy (SEM).
机译:本文在理论上调查了电场下裂纹压电陶瓷的低温断裂行为。在室温(RT)(RT)(RT)和液氮温度(77K)下,用单边缘预焊束(SEPB)样品进行裂缝试验,得到电场下的断裂载荷。使用压电陶瓷的温度依赖性材料特性还进行平面应变有限元分析,并讨论了能量释放率对电场和温度的依赖性。此外,通过扫描电子显微镜(SEM)检查低温骨折的可能机制。

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