1. Materials Must be Considered as an Integral Part of the Design 2. Voiding Must be Reduced to Increase Thermal Conductivity 3. Steps Must Be Taken to Reduce the Build up of Oxides 4. Oxides can be Reduced by Reducing the Oxygen Partial Pressure 5. Tooling must be designed to hold die to substrate Alignment 6. Good Temperature can Improve Solder Reflow 7. The use of Pressure Variation will Reduce Voiding.
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