In-situ Wafer Temperature Measurement During Firing Process via Inline Infrared Thermography

摘要

In this work, an inline IR thermography system as an innovative application for real-time contactless temperature measurement of wafers - both metallized and non-metallized - during the firing process has been successfully realized in an industrial firing furnace as proof-of-concept and example for a thermography system in a conveyor furnace. As observed by the new system, thermocouples seem to measure lower temperature on wafers -especially in combination with thermocouple-frames - than wafers exhibit at standard firing conditions (here up to ΔT≈40 K). Further, highly resolved spatial temperature distribution could be successfully measured on the wafer.