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Guided Wave Based Inspection of Integrated Circuit Packages Using the Time-Frequency Synchrosqueezing Transform

机译:使用时频同步转换的集成电路封装的引导波检查

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Ultrasonic guided waves have the potential to inspect integrated circuit (IC) packages using wave based techniquesdue to excellent sub surface penetration through metallic as well as dielectric material. Guided waves in aheterogeneous composite assembly such as an IC package have modes with complex dispersion characteristics due tomultiple layers of material with intricate geometry. No analytical solution exists for predicting dispersion in highlyanisotropic composites. Numerical methods, such as the finite element method, have been used to model dispersion incomposites, however these methods are computationally intensive and not feasible for predicting dispersion in ICpackages. In this paper, the time-frequency characteristics of guided waves propagating through a complex IC arestudied using the synchrosqueezing transform (SST). This is a transform that has been shown to be robust to boundedsignal perturbations, to provide highly localized time and frequency information for highly nonlinear modes, and toreconstruct the signal corresponding to each mode. Reference ultrasonic guided wave signals are collected for the ICpackage in its healthy and damaged states using piezoelectric transducers to characterize the dispersion modes in theexcitation region. Initial results demonstrate that the dispersive mode information from the extracted SST ridgesprovide an effective damage indicator for IC packaging.
机译:超声波引导波有可能使用基于波的技术检查集成电路(IC)包装由于优异的亚表面穿透通过金属和介电材料。引导波诸如IC封装的异构复合组件具有由于具有复杂分散特性的模式多层材料,具有复杂的几何形状。不存在分析解决方案,以便高度预测分散各向异性复合材料。数值方法(例如有限元方法)已被用于模拟分散体然而,这些方法是计算密集的,并且对于预测IC中的色散不可行包裹。在本文中,通过复杂IC传播的引导波的时频特性是使用SynchroSqueezing变换(SST)研究。这是一种转换,已被证明对界限具有稳健信号扰动,为高度非线性模式提供高度本地化的时间和频率信息,以及重建对应于每个模式的信号。收集IC的参考超声波引导波信号使用压电传感器在其健康和损坏的状态中包装,以表征分散模式激发区域。初始结果表明,来自提取的SST脊的分散模式信息为IC包装提供有效的损坏指示。

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