DEFORMATION BEHAVIOR OF GOLD/COPPER MULTILAYER SYSTEMS

摘要

Two sets of Au/Cu multilayers with a total thickness of 2 μm were deposited with magnetron sputtering onto Si/SiO_2 with an individual layer thickness of 250 nm and 25 nm. Subsets of the samples were treated with rapid thermal annealing (RTA) at temperatures of 300°C and 400°C for 60 s each to allow inter-diffusion and alloying at the Au/Cu interfaces.