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Structures and Properties of Self - crosslinking Silicone Resin

机译:自交联硅树脂的结构与性能

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Highly transparent silicone resin with self-crosslinking structure was prepared using phenyltrimethoxysilane, diphenyldimethoxysilane, 1,3,5,7-cyclotetra(methyl siloxane) and bisvinyltetramethyldisiloxane as main raw materials. The structure of silicone resin was determined by Fourier Transform Infrared Spectroscopy (FT-IR). The light transmittance was measured by UV-Vis spectroscopy. Thermogravimetric analysis (TGA) was used to study the thermal decomposition process. The microstructure of cured self-crosslinking silicone resin is more uniform, resulting in better light transmittance up to 100% in the range of 400nm ~ 800nm. The cured has relatively good heat resistance, the initial thermal decomposition temperature of the cured could be up to 315.8°C. SEM observations show that the self-crosslinking silicone has a uniform, textured structure, higher transparency compared with the existing condensation silicone material, and can be used as advanced architectural translucent materials and optics packaging materials.
机译:使用苯基,二苯基,1,3,5,7- cyclotetra(甲基硅氧烷)和bisvinyltetramethyldisiloxane为主要原料,制备具有自交联结构高度透明的硅酮树脂。有机硅树脂的结构通过傅里叶变换红外光谱(FT-IR)。的光透射率通过UV-Vis光谱测定。热重量分析(TGA)用于研究的热分解过程。固化的自交联的有机硅树脂的显微组织更加均匀,从而导致更好的透光率高达100%的在400nm的800nm的〜的范围内。固化后的具有相对良好的耐热性,固化的初始热分解温度可高达315.8℃。 SEM观察结果表明,自交联的有机硅具有均匀的,有纹理结构,更高的与现有的缩合有机硅材料相比透明性,并且可以用作高级架构半透明材料和光学封装材料。

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