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Macro Controlling of Copper Oxide Deposition Processes and Spray Mode by Using Home-Made Fully Computerized Spray Pyrolysis System

机译:采用自制全电脑喷雾热解系统,铜氧化铜沉积工艺和喷涂模式的宏观控制

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Thin Films of Copper Oxide (CuO) absorption layer have been deposited using home-made Fully Computerized Spray Pyrolysis Deposition system FCSPD on glass substrates, at the nozzle to substrate distance equal to 20,35 cm, and computerized spray mode (continues spray, macro-control spray). The substrate temperature has been kept at 450 °C with the optional user can enter temperature tolerance values ± 5 °C. Also that fixed molar concentration of 0.1 M, and 2D platform speed or deposition platform speed of 4mm/s. more than 1000 instruction program code, and specific design of graphical user interface GUI to fully control the deposition process and real-time monitoring and controlling the deposition temperature at every 200 ms. The changing in the temperature has been recorded during deposition processes, in addition to all deposition parameters. The films have been characterized to evaluate the thermal distribution over the X, Y movable hot plate, the structure and optical energy gap, thermal and temperature distribution exhibited a good and uniform distribution over 20 cm~2 hot plate area, X-ray diffraction (XRD) measurement revealed that the films are polycrystalline in nature and can be assigned to monoclinic CuO structure. Optical band gap varies from 1.5-1.66 eV depending on deposition parameter.
机译:在玻璃基板上使用自制的全电脑喷雾热解沉积系统FCSPD沉积氧化铜(CUO)吸收层的薄膜,在喷嘴上到基板距离等于20,35厘米,并继续喷雾,宏-Control喷雾)。基板温度已保持在450℃,可选用户可以进入±5°C的温度耐受值。还使固定摩尔浓度为0.1μm,2D平台速度或沉积平台速度为4mm / s。超过1000指令程序代码,以及图形用户界面GUI的特定设计,以完全控制沉积过程和实时监测,并在每200毫秒时控制沉积温度。除了所有沉积参数之外,还在沉积过程中记录温度的变化。薄膜已经表征以评估X,Y可移动的热板,结构和光学能隙,热和温度分布在20cm〜2热板面积上具有良好且均匀的分布,X射线衍射( XRD)测量表明,薄膜本质上是多晶的,并且可以分配给单斜螺母结构。光学带隙根据沉积参数而变化为1.5-1.66eV。

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