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Design of Shunted Piezoelectric Patches Using Topology Optimization for Noise and Vibration Attenuation

机译:利用拓扑优化进行噪声和振动衰减的分流压电贴片设计

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Passive structural vibration reduction and noise attenuation by means of shunted piezoelectric patches is addressed in this paper. In this technology, an elastic structure is equipped piezoelectric patches that are connected to passive shunt circuits. The piezoelectric patches convert a fraction of the mechanical energy of the vibrating structure into electrical energy, which is then dissipated via the shunt circuits. The optimization in terms of damping efficiency, of the full electromechanical system composed by a host elastic structure with bonded piezoelectric patches connected to shunt circuits, is under study in this work. The concept of topology optimization, based on the Solid Isotropic Material with Penalization method (SIMP), is employed to optimize the geometry of piezoelectric patches as well as their placement on the host elastic structure. The proposed optimization procedure consists of distributing the piezoelectric material in such a way as to maximize the modal electro-mechanical coupling factor (MEMCF) of the mechanical vibration mode to which the shunt is tuned.
机译:本文通过了通过分流压电贴片的被动结构减振和噪声衰减。在该技术中,弹性结构配备了连接到被动分流电路的压电贴片。压电贴片将振动结构的机械能的一部分转换成电能,然后通过分流电路散发。在该工作中,在由连接到分流电路的粘合压电贴片组成的宿主弹性结构组成的宿主弹性结构的全机械系统的优化。拓扑优化的基于固体各向同性材料可罚法(SIMP)的概念,中,采用以优化压电片的几何形状以及它们在主机弹性结构放置。所提出的优化过程包括以这样的方式以最大化到所述分流被调谐到的机械振动模式的模态机电耦合因子(MEMCF)分配压电材料的。

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