Hybrid III-V/Silicon Photonic Integrated Circuits for High Bitrates Telecommunication Applications

摘要

We report on our recent advances on integrated hybrid InP/SOI transmitters using the Silicon Photonic fabrication technology. We demonstrate the direct modulation at 10 Gbits/s of different laser configurations such as wavelength tunable lasers, Distributed FeedBack (DFB) lasers and Chirp Managed Lasers (CMLs). We will also present the design, fabrication and characterization of various hybrid InP/SOI transmitters integrating lasers (tunable or DFB) and modulators (silicon or III-V) with modulation up to 32 Gbits/s.