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Fabrication of nano-scale high aspect ratio ultra sharp tips for nano-mechanical structures at low thermal budget

机译:低热预算下纳米尺度高纵横比的纳米尺度高纵横比超锋利提示

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In this paper, we demonstrate a novel approach to form ultra-sharp high-aspect-ratio and high density nanotips at low temperature suitable for integration with nano-electro-mechanical structures in CMOS compatible manner. For the first time, Cr thermally evaporated Spindt tips have been studied and achieved a tip radius as small as 3nm. An array of 250nm wide and 4μm tall nanotips have been fabricated with a high aspect ratio of 16 and high density of 1×10~9tips/cm~2. Furthermore, 250nm wide, 1.2μm tall tips have been integrated onto an array of 500nm wide silicon nanowires with high precision and yield. Potential application of the approach includes the development of high-speed parallel AFM on single chip.
机译:在本文中,我们证明了一种新的方法,以在适用于CMOS兼容方式中以与CMOS兼容方式的纳米电力结构集成的低温在低温下形成超尖锐的高纵横比和高密度纳米。首次,已经研究了CR热蒸发的SPINDT提示,并实现了小于3nm的尖端半径。已经制造了250nm宽和4μm高的纳米阵列的阵列,具有16宽度为16且高密度为1×10〜9TIPS / cm〜2。此外,250nm宽,1.2μm高尖端已集成在500nm宽的硅纳米线上,具有高精度和产量。该方法的潜在应用包括在单芯片上开发高速平行AFM。

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