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Gold Recovery from Waste Solutions of PCBs Gold Plating Process Using Hydro Cyclone Reactor for Demonstration Study

机译:使用水旋风反应器进行PCBS金电镀工艺废物解决方案的黄金恢复

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This paper presents a novel methodology to recover gold from waste solutions of printed circuit boards (PCBs) generated during the gold electro-plating. Studies have been carried out using two different sizes of hydrocyclone (357.00 and 381.87 mm height) at various parameters such as current, flow rate, electrolyte concentration, cathode materials, and anodic area to recover the gold. ~96% gold was recovered using short-cone type hydrocyclone (357.00 mm) at following conditions: applied current 51.3 A/m~2, flow rate 7.7 m/s, using stainless steel as cathode material. However, approximately same amount of gold can be also recovered with long-cone type hydrocyclone (381.87 mm). But, the possibility for damage of long-cone type hydrocyclone might be higher than short cone type hydrocyclone because reaction occurs only at small reaction surface area during gold recovery. Therefore, short-cone type hydrocyclone has been considered for further study to recover gold.
机译:本文提出了一种新的方法,可以从金电镀期间产生的印刷电路板(PCB)的废物溶液中恢复黄金。在各种参数下使用两种不同尺寸的水力旋流器(357.00和381.87mm高度)进行研究,例如电流,流速,电解质浓度,阴极材料和阳极区域以回收金。使用短锥型水力旋流器(357.00 mm)回收〜96%的金色条件:使用不锈钢作为阴极材料,施加电流51.3a / m〜2,流速7.7 m / s。然而,大致相同的金子也可以用长锥形水力旋流器(381.87mm)回收。但是,长锥型水力旋流器损伤的可能性可能高于短锥型水力型,因为在金回收率期间仅在小反应表面积处发生反应。因此,已经考虑了短锥型水力旋流器进一步研究以恢复金。

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