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The heating effect on different light emitting diodes chips materials

机译:不同发光二极管芯片材料的加热效果

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In this paper, simulation of non-radiative recombination heating and Joule heating effects based on different material of a light emitting diodes chip for Gallium Nitride, Indium Nitride, Zinc Oxide, Zinc Selenide and Titanium Dioxide are demonstrated. Among the light emitting diodes chips materials, Indium Nitride, Zinc Oxide and Zinc Selenide has the capability to produce the highest non-radiative recombination heating which the heating value is potential up to ×10~(12) to ×10~(13) W/m~3. Meanwhile, Titanium Dioxide has the capability to generate higher value of non-radiative recombination heating with lowest value of electron carriers concentration. For the joule heating effect, the Titanium Dioxide shows the fast heating behavior as compared with other materials.
机译:本文证明了基于氮化镓,氮化铟,氧化锌,硒化锌和二氧化钛的发光二极管芯片的不同材料的非辐射重组加热和焦耳加热效果的模拟。在发光二极管芯片材料中,氮化铟,氧化锌和硒化锌具有能够产生最高的非辐射重组加热,其加热值电位高达×10〜(12)至×10〜(13)W. / m〜3。同时,二氧化钛具有能够产生具有最低值的电子载体浓度的不辐射重组加热值的能力。对于焦耳加热效果,二氧化钛显示与其他材料相比的快速加热行为。

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