首页> 外文会议>PRiME Joint International Meeting of the Electrochemical Society, the Electrochemical Society of Japan, and the Korean Electrochemical Society >Electrodeposition of Si Film from Water-Soluble KF-KCl Molten Salt and Feasibility of SiCl_4 as a Si Source
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Electrodeposition of Si Film from Water-Soluble KF-KCl Molten Salt and Feasibility of SiCl_4 as a Si Source

机译:Si膜的电沉积来自水溶性Kf-KCL熔盐和SiCl_4的可行性作为Si源

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Toward an establishment of a new production method of solar cell substrates, electrodeposition of Si was investigated in molten KF-KCl (eutectic composition, 45:55 mol%) after the introduction of SiCl_4. Gaseous SiCl_4 was directly introduced into the molten salt at 1023 K by a vapor transport method using Ar carrier gas. The dissolution ratio of SiCl_4 exceeded 80% even with the use of a simple tube for the bubbling. Galvanostatic electrolysis was conducted at 923 K on a Ag substrate at 155 mA cm~(-2) for 20 min in molten KF-KCl after the dissolution of 2.30 mol% SiCl_4. Although compact Si layer was formed, the smoothness was lower compared to that obtained from the melt after the addition of K_2SiF_6. The anionic molar fraction is probably one of the factors affecting the morphology of deposit.
机译:在引入SiCl_4后,在熔融KF-KCl(共晶组合物,45:55mol%)中研究了Si的电沉积,在熔融Kf-KCl(共晶组合物,45:55mol%)中进行了电沉积。通过使用Ar载气的蒸汽传输方法直接将气态SiCl_4直接引入熔盐中。即使使用用于鼓泡的简单管,SICL_4的溶出比率也超过了80%。在溶解2.30mol%SiCl_4的溶解后,在熔融KF-KCl上以923k在155mA cm〜(-2)上在923k上以923k进行电解。尽管形成了紧凑的Si层,但与在加入K_2SIF_6之后从熔体中获得的相比,平滑度降低。阴离子摩尔分数可能是影响沉积物形态的因素之一。

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