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Laser Surface Cleaning for Joining Preparation in Lightweight Production

机译:激光表面清洁,用于在轻质生产中加入制剂

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Cleaning and pre-treatment of the surface is an important prerequisite for a high-quality weld and adhesive bond area. The laser process vaporizes dirt particles, oxide layers and other contaminations prior to joining operations. Laser pre-treatment leaves the metallic surface free of contamination and well prepared for welding and bonding. The substrate is not damaged by the laser light. Metallic materials can be "modified" within the upper boundary layer using appropriately intensified laser parameters. This means the surface of the substrate can be enlarged and passivated to match the bonding mechanisms. The passivation of the surface greatly improves the corrosion behavior of light. The substrate is resistant to age and environmental damage. The laser light removes oxide layers including superficial contamination, e.g. from light alloy surfaces. The near-surface zone in the area of typically ~ 1 μm is re-melted within a few nanoseconds, the melt quickly being cooled simultaneously. By dissolving the grain boundaries and due to the heat capacity of the part a "quenching" occurs. This results in a new micro-crystalline amorphous and rough boundary layer (passivation layer) with significantly decreased element corrosion behavior. The modification processes is automatic when exposed to air without any protective gas. The new, passivation oxide layer on top of the melt forms a very stable bond with the adhesive. Combined with the decreasing electro-chemical potential of current aluminum and magnesium alloys this leads to long-term, age-resistant bonds. Short-term re-melting leads to additional micro craters" that cause a significant surface enlargement and thus an increased load transmission particularly under shear load.
机译:清洁和预处理表面是高质量焊接和粘合剂面积的重要前提。激光过程在加入操作之前蒸发污垢颗粒,氧化物层和其他污染物。激光预处理使金属表面不含污染和良好的焊接和粘合。基板不会被激光损坏。使用适当强化激光参数,金属材料可以在上边界层内“修改”。这意味着可以扩大基板的表面并钝化以匹配粘合机构。表面的钝化大大提高了光的腐蚀行为。底物是抗年龄和环境损伤的抗性。激光去除包括浅表污染的氧化物层,例如,从轻的合金表面。通常〜1μm面积的近表面区在几纳秒内重新熔化,熔体同时冷却。通过溶解晶界并由于部分的热量而发生“淬火”。这导致具有显着降低的元件腐蚀行为的新微晶非晶和粗边界层(钝化层)。在没有任何保护气体的情况下暴露在空气中时,修改过程是自动的。熔体顶部的新的钝化氧化物层与粘合剂形成非常稳定的结合。结合当前铝和镁合金的电化学电位的降低,这导致长期的抗性粘合剂。短期重新熔化导致额外的微陨石坑“导致显着的表面放大,因此特别是在剪切载荷下增加的负载传输。

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