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Grain Changing Simulation of the Copper Sheet Indented by a Conical Diamond for a micro hole forming

机译:通过锥形金刚石缩进的微孔成型晶粒缩进的晶粒

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The method of micro hole forming indented by a conical diamond into a metal sheet based on glass substrate is an innovation. In order to solve the cracks problem of the hole edge during the indention experiment at present, the changing simulation of grain size and effective stress of the copper sheet material indented by a conical diamond is researched using the Deform 3D software with the point tracking function in this paper to reveal the mechanics changing regularity. And the mechanics of micro structure reason is analyzed with some solving method provided. The work in this paper can guide the further research with the visual simulation results without experiment cost.
机译:通过锥形金刚石凹入基于玻璃基板的金属片凹入的微孔形成的方法是一种创新。为了解决目前的缩进实验期间孔边缘的裂缝问题,使用Deform 3D软件在具有点跟踪功能的情况下,研究了通过锥形钻石凹入的晶粒尺寸和铜板材料的有效应力的变化模拟本文揭示了改变规律性的力学。通过提供的一些求解方法分析了微结构原因的机制。本文的工作可以指导进一步研究视觉模拟结果而无需实验成本。

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