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Study on catalysis effect of TEPB on the curing reaction of HTPB binder system

机译:TEPB对HTPB粘合剂系统固化反应的催化作用研究

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The catalysis effect of tri (exhoxyphenyl) bismuthine (TEPB) on the curing reaction of HTPB binder system was studied by using DSC method. The curing peak temperatures of the catalyst systems were measured to calculate kinetic parameters by using Kissinger and Crane methods, respectively. Two curing reaction kinetic equations were established. The results show that TEPB has high catalytic activity and can decrease the curing temperature of HTPB binder system, down to 35°C, in which the optimum volume of TEPB is 0.5% of HTPB binder system.
机译:通过使用DSC方法研究了Tri(Exhoxyphenyl)铋(TEPB)对HTPB粘合剂体系固化反应的催化作用。测量催化剂体系的固化峰温度,分别通过使用吻手柄和起重机方法计算动力学参数。建立了两种固化反应动力学方程。结果表明,TEPB具有高催化活性,可以降低HTPB粘合剂系统的固化温度,下降至35°C,其中TEPB的最佳体积为HTPB粘合剂系统的0.5%。

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